英德
有道
百度
谷歌
图片
维基
百科
电路工艺
circuit technology
- 将传感器与信号调节电路利用厚膜电路工艺进行混合封装，完成了传感器的一体化，实现了传感器的小型化。
Sensor and signal regulating circuit is carried out through hybrid packaging by making use of thick-film circuit technology,which realizes integration and minimization of sensor. - 集成电路工艺的进步和电路规模扩大带来的测试挑战,要求越来越多的芯片包含内建自测试(BIST)电路。
Test challenges brought by advancement of IC processes and enlargement of chip scales require thatBuilt-in Self-test (BIST) should be included in more and more chips. - 随着集成电路工艺的飞速发展，人们已经可以将原先的板级系统集成在一块芯片上，系统芯片逐渐成为集成电路设计的主流发展趋势。
With the development of semiconductor process technology a system on a PCB(Printed Circuit Board)which is composed of several ICs can be integrated into a chip.
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