bga (ball grid array,球状矩阵排列)
- Assembly of Advanced packages such as Ball Grid Array (BGA) and Chip Size Package (CSP).
先进封装的装配,如球形焊点阵列和芯片尺寸封装. - Unique built-in sucker is used to lift up and place the component to meet BGA non-touch nature.
独有内置吸盘,可提起及重置组件,符合BGA免触的特性。 - Vacuum pen device is used to lift up and place BGA from/on main board to meet BGA non-touch nature.
真空吸放笔装置,实现零作用力吸放功能,符合BGA免触的特性,无损拆焊的组件。
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