集成电路封装 [电子] integrated circuit package
- 本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计。
This product design for IC assembly die attache process on die bonder machine. - 集成电路封装的发展方向是高密度、低成本和高可靠性。
The high reliability and low cost will lead the development of the electronic packaging. - 介绍了电子集成电路封装行业中常见的锡须的形状及长度。
The usual shapes and lengths of tin whisker in electronic integrated circuit (ECI) encapsulation industry were introduced.