球焊 pellet bonding
nail head bonding
- 在焊球合金、焊料合金、峰值温度、液相线以上时间和焊接环境五个关键因素中,前四项对焊点可靠性比较重要,焊接环境对焊点可靠性的影响不很显著。
In the five key factors of solder ball alloy, solder paste alloy, peak temperature, the time above liquidus and soldering environment, the fore four factors are more important than soldering environment to the solder joints reliability.