沉铜 electroless plating copper
- 结果表明,优选出的的镀液稳定性相对较高、沉铜速度快、镀层外观较好。
The factors affecting the deposition rate of copper and stability of electroless copper plating solution were investigated. - 红色的圆,我们发现独立的孔没有铜皮在上面,请确认他们做沉铜孔还是非铜孔,请确认!
As red circle, we found the hole are isolated and no copper on it, please confirm whether the holes are npth hole or pth hole? - 研究了从分银炉渣中回收铜与铋的新工艺,主要过程包括硫酸浸铜、盐酸浸铋、中和沉铋、碳酸钠沉铜等。
This paper describes briefly the technical conditions of technical process and equipment of major copper smelters in the world and raises suggestions on modification of Baiyin furnace.