凸点 [
tū diǎn]
salient point
- 他用不同的凸点代表不同的字母。
Different dots were raised for different letters. - 速度分离"表明金凸点/焊盘界面已初步形成键合强度。
Stall indicated that the bump/pad interface has formed initial bonding strength. - 介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
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