lead-frame 引线框架
- The microstructure and performance of lead-frame copper alloy of C72500 as-cast was studied.
研究了C72500铸态铜合金引线框架材料的微观组织和性能。 - This article presents briefly the mam lead-Frame Materials used abroad and the developments in recent years.
本文简单介绍了国外使用的主要引线框架材料及其近年来的新开发。 - Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
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