英德
有道
百度
谷歌
图片
维基
百科
圆片级
[电子] wafer level
- 对圆片级封装（WLP）的结构设计和关键工艺技术进行了研究；
Structure designing and key processing technologies for wafer level package(WLP) were studied. - 探讨了器件级与圆片级真空封装的基本工艺原理。
and researches are made on the technical principles of the device level and wafer level of the vacuum packaging. - 对半导体制造业来说，内建可靠性方法由两大部分组成：圆片级可靠性系统和内建可靠性数据库。
The BIR manufacturing framework consists of two major systems: wafer- level reliability (WLR) and the BIR database .
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